
Product Application:
- Electronic Insulation
- Electrical Insulation
- Composite Material
- Civil Engineering
and Coating
- Adhesive and Decoration
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Adhesive and Decoration Application
Home > Product
Application > Adhesive and Decoration
- Application of Adhesive and Decoration
Epolab
Chemical, a specialist in epoxy application. We offer variety of epoxy
compound, epoxy prepreg, adhesive epoxy, potting compound, hot melt,
epoxy resin, solvent, electronic powder coating material, composite
materials, epoxy glue etc. Our products are well accepted in the electronic,
electrical, civil engineering, composite material and adhesive field.
For more detailed information, please look at product images and related
specifications. |
| Owing
to following characteristics of epoxy resins, they are widely used
in adhesive and decoration application: |
|
1 |
High thermal resistance |
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2 |
Good adhesion to various materials |
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3 |
Low cost |
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4 |
Compatibility with various substrate
& other additives |
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5 |
Low shrinkage |
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6 |
Availability of slvent free formulation |
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7 |
Light in color |
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8 |
Easy to control viscosity |
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9 |
Low vapor pressure |
PRODUCTS
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1 |
EPORITE 2089 One component adhesive
(for electronic parts) |
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2 |
EPORITE 2095 One component adhesive
(high viscosity) |
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3 |
EPORITE 2066 One component adhesive
(fast cured) |
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4 |
EPORITE 2088 One component adhesive
(high thermal conductivity) |
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5 |
EPORITE 5100 A/B Two-component adhesive |
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6 |
EPORITE 5408 A/B Decorative coating
(hard) |
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7 |
EPORITE 5418 A/B Decorative coating
(soft) |
Table shows parts of
the products.
Other products are available.
PROCESSING
METHODS
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1 |
Coating |
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2 |
Encapsulation |
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3 |
Adhesives |
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4 |
One-pack epoxy adhesives |
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5 |
Two-pack epoxy adhesives |
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TYPICAL
MARKETS
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1 |
Decorative coatings |
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2 |
Protective coatings |
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3 |
Industrial adhesives |
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4
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Adhesives of metal & EI core
ceramic etc |
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5
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Adhesives of wood & Ceramic
etc |
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6
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Adhesives of electronic parts
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