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  • Prepreg Application of Composite Material
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Product Application:
- Electronic Insulation
- Electrical Insulation
- Composite Material
- Civil Engineering and Coating
- Adhesive and Decoration
 


Composite Material Application

Home > Product Application > Composite Material

  • Application of Composite Material
Epolab Chemical, a specialist in epoxy application. We offer variety of epoxy compound, epoxy prepreg, adhesive epoxy, potting compound, hot melt, epoxy resin, solvent, electronic powder coating material, composite materials, epoxy glue etc. Our products are well accepted in the electronic, electrical, civil engineering, composite material and adhesive field. For more detailed information, please look at product images and related specifications.

Epoxy resins are also modified for fibre reinforced plastic application because of the following advantages:

1
Good flexibility
2
Excellent mechanical strength
3
Low specific gravity
4
Good adhesive to various fiber
5
High thermal resistance
6
High impact strength
7
Long pot life
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PRODUCTS
1
EPORITE ESP series For Solvent type prepreg
2
EPORITE ESFP series For Filament winding
3
EPORITE EHM series For hot-melt method prepreg
4
EPORITE BMC series Bulk molding compound
5
EPORITE SMC series Sheet molding compound
6
EPORITE EMC series Electronic molding compound
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Table shows parts of the products.
Other products are available.



PROCESSING METHODS
1
Filament winding
2
Solvent type prepreg
3
Solvent Free type prepreg ( Hot-melt )
4
Impregnation
5
Pultrusion
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TYPICAL MARKETS
1
Shaft
2
Rocket
3
Clad board
4
Rod
5
Hockey
6
Ski stick


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